| Change log entry 64001 | |
|---|---|
| Processed by: | goldyn_chyld (2017-07-02 17:43:02 UTC) |
| Comment: |
<< review queue entry 60641 - submitted by 'richwarm' >> 基因晶片的製造從探針設計、探針合成、晶片基材、探針佈放、 the manufacture of gene chips involves over 200 individual steps, from probe design, probe synthesis, making the chip substrate, probe deposition, J ~ The first requirement for any adhesive bond is that the adhesive most wet the substrate. 对所有粘结剂粘结的首先要求，就是必须能浸润基材。 Web ~ 於晶片或其他基材(substrate)表面製造可運動或形變的微小機械結構 |
| Diff: |
+ 基材 基材 [ji1 cai2] /substrate/ |